T6-EVO 2A Tray Scanning System
COMPANY DESCRIPTION
VisDynamics provides equipment solution to the semiconductor assembly & test industry with standalone or integrated package handling, electrical test, inspection, tape & reel etc using our own proprietary technologies. All our equipment are designed and manufactured with simplicity, cost effectiveness & best-in-class performance as major objectives that had rewarded us with extensive customer acceptance in a very short time in this highly competitive market.
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Features:
Sprint UPH: >22K Tray to Tray
(MLF/QFN4x4 to 5×5 with Tray Matrix: 12×35)
Jedec Tray Input Loader to Output Unloader & tape & Reel
DUAL UNIVERSAL GANG PICK (URP) – Conversion free
Support package type: QFN/TSOP/BGA/LGA/FCBGA/TFBGA/QFP, etc.
Bottom 2D Ball/Lead inspection
Bottom 3D Laser inspection system for Ball/Lead
2D In-Tray Inspection system
Combined lot management capability
Auto unit reject/replenish management
Configurable with Programmable 3 good/reject tray output
System support Heat or pressure seal
Machine dimension: W:205cm x D:160cm x H:175cm
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