1. . Test Sockets and Burn-in Cycling Sockets
– For package testing of semiconductor devices: Memory, Logic, RF, Sensor, Burn-in, etc.
– Various package types: BGA, LGA, MLF, QFN, WLCSP (Wafer Level Chip-Scale Package) and others
2. 2. Interposers (Silicone Rubber)
– For probe cards and pad-to-pad interconnections to provide physical and electrical interface between tester and DUT
3. 3. Manual Test Solutions
– For low-volume and product development applications
– Manual Test Housing, Test JIG
4. 4. Leadframe (Finger) Test Solutions
– Finger Test Sockets