Automatic Hight Speed transfer of 8″ &12′ ‘ wafers System Features :-
Machine Features:
-Wafer size 300 mm (12″)
-Sorting of two wafer sizes in one machine
-Robot with FOSB mapping function
-Pre-aligner MODULE FOR 200 mm (8″) and 300 mm (12″) wafer
-Cross slot wafer detection
-Wafer protrusion detection
-Touch screen display
-Windows PC-Based user friendly Graphical User Interface
-Wafer sorting selection by recipe or operator
-Up to 180 WPH
Options:
-Wafer size 200 mm (8″)
-SECS/GEM
-Wafer-ID reader for OCCR and barcode
-Dual end effector for maximum throughput
-Vision pre-aligner for 200 mm (8″) and 300 mm (12″) wafer ( only top OCR configuration available)
-Auto recipe selection
-UPS (uninterruptable power supply)
-CDA and N2 pressure Indicator
-Bottom side OCR module
-Additional 3rd Load port for Split and Merging