T6Evo-3 High Speed Tray Scanning System
COMPANY DESCRIPTION
VisDynamics provides equipment solution to the semiconductor assembly & test industry with standalone or integrated package handling, electrical test, inspection, tape & reel etc using our own proprietary technologies. All our equipment are designed and manufactured with simplicity, cost effectiveness & best-in-class performance as major objectives that had rewarded us with extensive customer acceptance in a very short time in this highly competitive market.
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Features:
Sprint UPH: >20K Tray to Tape & Reel (MLF/QFN4x4 / Tray Matrix: 12×35)
>40k Tray to Tray (MLF/QFN4x4 / Tray Matrix: 12×35)
Jedec Tray Input to Jedec Tray . Tape & Reel output
DUAL UNIVERSAL GANG PICK (UGP) – CONVERSION FREE WITHOUT KIT
Support package type: QFN/TSOP/BGA/LGA/FCBGA/TFBGA/QFP, etc.
Bottom 2D Ball/Lead inspection
Bottom 3D Laser inspection system for Ball/Lead
2D In-Tray Inspection system
2D In-Pocket Inspection system
Configurable with Programmable 3 good/ reject tray output (fully automatic)
Triple pick and place pen with rotator
Machine dimension: W:2.07m x D:2.2m x H:2.0m
OPTIONS:
POST SEAL IN SPECTION SYSTEM
AUTOMATIC MOTORISER TAPING TRACK CONVERSION
DOUBLE UNIT INSPECTION SYSTEM
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