On-line and Stand alone metrology solutions for advanced process control.

Heater Jacket and Heater control solution for gasline, pump line and exhaust line to improve process yield in fabs and OEM equipment.

Non Contact Sensor measurement of wafer thickness during CMP, Backgrinding process. Wafer Warpage Measurement. Wire loop and bond height measurement in 3D packaging.

Automated process control equipment for chemical-based manufacturing with a focus on metal deposition (electroplating and electroless)

Automatic Wafer Packer/Unpacker/Sorter and Loader integration. Semi Auto and Manual Wafer Mounter, Automatic and Manual Wafer ID and Frame ID Reader. Advance technology for thin wafer handling and tape mount.

Non Contact Sensor measurement of wafer thickness

Comprehensive wafer level to system level probe test solution. Unique cost effective Vertical probe card

Automated Packing solutions

Precision Laser Technology Solution

Cost effective standalone/integrated package handling system with gravity, bowl or tray based input to flexible options of electrical test, inspection and tape & reel.

5G High Speed Test Socket Solution

MOSFET and Power Management IC Test Solution

Wire loop and bond height measurement in 3D packaging

KES93. Total leading Burn-In Solution Provider

IC Decapsulation System

Wafer/Package Level Reliability Tester

Advanced FA microscope systems and temperature measurement microscope systems.