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Heater Jacket and Heater control solution for gasline, pump line and exhaust line to improve process yield in fabs and OEM equipment.
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Non Contact Sensor measurement of wafer thickness during CMP, Backgrinding process. Wafer Warpage Measurement. Wire loop and bond height measurement in 3D packaging.
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Automated process control equipment for chemical-based manufacturing with a focus on metal deposition (electroplating and electroless)
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Automatic Wafer Packer/Unpacker/Sorter and Loader integration. Semi Auto and Manual Wafer Mounter, Automatic and Manual Wafer ID and Frame ID Reader. Advance technology for thin wafer handling and tape mount.
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Comprehensive wafer level to system level probe test solution. Unique cost effective Vertical probe card
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Cost effective standalone/integrated package handling system with gravity, bowl or tray based input to flexible options of electrical test, inspection and tape & reel.